TE Connectivity 4-1734062-1 Applies To: Printed Circuit Board Assembly Process Feature: Without Pick and Place Cover Contact Plating, Mating Area, Material: Gold Contact Plating, Mating Area, Thickness (?µm [??in]): 0.762 [30] Contact Termination Type: Through Hole Gender: Receptacle Housing Color: Black Industry Standard: USB 2.0 Lead Free Solder Processes: Reflow solder capable to 245?°C, Reflow solder capable to 260?°C Led: Without Locating Post(s): Without Locking Feature: Without Mount Location: Top Edge Number Of Ports: 2 Number Of Positions: 4 Orientation: Right Angle Packaging Method: Tube Panel Ground: Without Pcb Mount Retention Type: SMT Hold Down, Straight Leg Pcb Thickness, Recommended (mm [in]): 1.00 [0.039] Rohs/elv Compliance: RoHS compliant, ELV compliant Rohs/elv Compliance History: Always was RoHS compliant Series: A Shell Plating: Nickel over Copper Size: Standard Tail Length (mm [in]): 2.81 [0.111] Termination Method: Solder Usb-if Test Id Number (tid): Not Submitted For Testing